Screening of electroplating additive for improving throwing power of copper pyrophosphate bath via molecular dynamics simulation
| Autor: | Li, Qingyang, Hu, Jiaping, Zhang, Jinqiu, Yang, Peixia, Hu, Yidong, An, Maozhong |
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| Zdroj: | In Chemical Physics Letters 16 October 2020 757 |
| Databáze: | ScienceDirect |
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