| Autor: |
Aida, H., Baisie, E.A., Boning, D., Borucki, L., Cook, Lee, Fan, W., Schumacher-Härtwig, H., Krishnan, M., Künzelmann, U., Lagudu, Uma Ramesh Krishna, Lee, Kangchun, Li, Z.C., Lofaro, M.F., Moon, Y., Nalaskowski, J., Ong, P., Paik, Ungyu, Park, Jin-Goo, Pate, K., Penta, N.K., Philipossian, A., Yerriboina, Nagendra Prasad, Papa Rao, S.S., Roy, Dipankar, Safier, P., Sampurno, Y., Seo, Jihoon, Song, Z., Speed, D.E., Teugels, L., Theng, S., Tseng, Wei-Tsu, Tsujimura, M., Wang, L., Zhang, Q., Zhang, X.H., Zwicker, G. |
| Zdroj: |
In Advances in Chemical Mechanical Planarization (CMP) Edition: Second Edition. 2022:xi-xiii |
| Databáze: |
ScienceDirect |
| Externí odkaz: |
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