10 - Transient copper removal rate phenomena with implications for polishing mechanisms
| Autor: | Borucki, L., Sampurno, Y., Theng, S., Philipossian, A. |
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| Zdroj: | In Advances in Chemical Mechanical Planarization (CMP) Edition: Second Edition. 2022:237-257 |
| Databáze: | ScienceDirect |
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