Chemical additives for improved copper chemical vapour deposition processing
| Autor: | Norman, John A.T., Roberts, David A., Hochberg, Arthur K., Smith, Paul, Petersen, Gary A., Parmeter, John E., Apblett, Chris A., Omstead, Thomas R. |
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| Zdroj: | In Thin Solid Films 1995 262(1):46-51 |
| Databáze: | ScienceDirect |
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Full Text from ScienceDirect