A study of long time reliability test of mold-encapsulated ICs : Seiji Iwashita, Hitoshi Itoh and Toshi Akitsuru. Proceedings of the 22nd Symposium on Reliability and Maintainability, Tokyo, Japan. Union of Japanese Scientists and Engineers, 9 (June 1992)

Zdroj:	In Microelectronics Reliability 1993 33(13):2058-2058
Databáze:	ScienceDirect
Externí odkaz:	Zobrazit plný text záznamu