Thermal stress analysis of tape automated bonding packages and interconnections : John H. Lau, Donald W. Rice and C. Girvin Harkins. IEEE Trans. Compon. Hybrids mfg Technol.13(1), 182 (1990)

Zdroj: In Microelectronics Reliability 1991 31(1):208-208
Databáze: ScienceDirect
Externí odkaz: