Bonding at Cu-Al interfaces: Relevance to microcircuit packaging
| Autor: | Cain, Stephen R., Woychik, Charles G. |
|---|---|
| Zdroj: | In Journal of Physics and Chemistry of Solids 1992 53(2):253-260 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
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| Autor: | Cain, Stephen R., Woychik, Charles G. |
|---|---|
| Zdroj: | In Journal of Physics and Chemistry of Solids 1992 53(2):253-260 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|