The chemistry of the additives in an acid copper electroplating bath: Part I. Polyethylene glycol and chloride ion
| Autor: | Healy, John P., Pletcher, Derek, Goodenough, Mark |
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| Zdroj: | In Journal of Electroanalytical Chemistry 1992 338(1):155-165 |
| Databáze: | ScienceDirect |
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