| Autor: |
Ali Roshanghias, Perla Malago, Jaroslaw Kaczynski, Timothy Polom, Jochen Bardong, Dominik Holzmann, Muhammad-Hassan Malik, Michael Ortner, Christina Hirschl, Alfred Binder |
| Jazyk: |
angličtina |
| Rok vydání: |
2021 |
| Předmět: |
|
| Zdroj: |
Energies, Vol 14, Iss 8, p 2176 (2021) |
| Druh dokumentu: |
article |
| ISSN: |
1996-1073 |
| DOI: |
10.3390/en14082176 |
| Popis: |
Copper sinter paste has been recently established as a robust die-attach material for high -power electronic packaging. This paper proposes and studies the implementation of copper sinter paste materials to create top-side interconnects, which can substitute wire bonds in power packages. Here, copper sinter paste was exploited as a fully printed interconnect and, additionally, as a copper clip-attach. The electrical and thermal performances of the copper-sinter paste interconnections (“sinterconnects”) were compared to a system with wire bonds. The results indicate comparable characteristics of the sinterconnect structures to the wire-bonded ones. Moreover, the performance of copper sinterconnects in a power module was further quantified at higher load currents via finite element analysis. It was identified that the full-area thermal and electrical contact facilitated by the planar sinterconnects can reduce ohmic losses and enhance the thermal management of the power packages. |
| Databáze: |
Directory of Open Access Journals |
| Externí odkaz: |
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