Passive and Chipless Packaged Sensor for the Wireless Pressure Monitoring in Harsh Environment

Autor: Julien Philippe, Cristina Arenas, Dominique Henry, Anthony Coustou, Alexandre Rumeau, Hervé Aubert, Patrick Pons
Jazyk: angličtina
Rok vydání: 2017
Předmět:
Zdroj: Proceedings, Vol 1, Iss 4, p 629 (2017)
Druh dokumentu: article
ISSN: 2504-3900
DOI: 10.3390/proceedings1040629
Popis: A new millimetre-wave passive and chipless packaged sensor for wireless pressure monitoring in harsh environment is proposed. This sensor uses a planar microstrip resonator coupled with a high resistivity silicon membrane. The remote interrogation of this sensor is performed from a Frequency-Modulated Continuous-Wave (FMCW) radar. Prototypes have been designed and fabricated using photoresist intermediate layer for the silicon membrane bonding. Pressure characterization of packaged sensor validate the transducer and packaging hermeticity. The sensor sensitivity is close to 2% per bar for the resonant frequency and the radar response is evaluated at 2 dB per bar.
Databáze: Directory of Open Access Journals