Recent Advances in Thermoplastic Microfluidic Bonding

Autor: Kiran Giri, Chia-Wen Tsao
Jazyk: angličtina
Rok vydání: 2022
Předmět:
Zdroj: Micromachines, Vol 13, Iss 3, p 486 (2022)
Druh dokumentu: article
ISSN: 2072-666X
48943711
DOI: 10.3390/mi13030486
Popis: Microfluidics is a multidisciplinary technology with applications in various fields, such as biomedical, energy, chemicals and environment. Thermoplastic is one of the most prominent materials for polymer microfluidics. Properties such as good mechanical rigidity, organic solvent resistivity, acid/base resistivity, and low water absorbance make thermoplastics suitable for various microfluidic applications. However, bonding of thermoplastics has always been challenging because of a wide range of bonding methods and requirements. This review paper summarizes the current bonding processes being practiced for the fabrication of thermoplastic microfluidic devices, and provides a comparison between the different bonding strategies to assist researchers in finding appropriate bonding methods for microfluidic device assembly.
Databáze: Directory of Open Access Journals