Defects analysis of copper wires manufactured in industrial conditions

Autor:	M. Zasadzinska, B. Smyrak, T. Knych, P. Strzepek
Jazyk:	angličtina
Rok vydání:	2022
Předmět:	copper wires drawing process wire defects fracture scanning electron microscopy (SEM) Mining engineering. Metallurgy TN1-997
Zdroj:	Metalurgija, Vol 61, Iss 3-4, Pp 774-776 (2022)
Druh dokumentu:	article
ISSN:	0543-5846 1334-2576
Popis:	Many factors are responsible for the formation of surface and internal defects during copper wire drawing process. Generally they may be divided into defects of material or processing origin. Even input material of the highest quality with little to none defects cannot ensure the absence of breakages during the process due to inadequate process parameters. Optimally selected process parameters may reduce the risk of cracks forming during the metal forming process. The paper presents examples of wire defects and cracks occurring throughout the wire drawing process of copper in industrial conditions and a wide analysis of their source.
Databáze:	Directory of Open Access Journals
Externí odkaz:	https://doaj.org/article/f64a96d47c5b4acbb489194b384a1a5f Zobrazit plný text záznamu View record in DOAJ Plný text ve formátu PDF