Back-end-of-line a-SiOxCy:H dielectrics for resistive memory

Autor: J. Fan, O. Kapur, R. Huang, S. W. King, C. H. de Groot, L. Jiang
Jazyk: angličtina
Rok vydání: 2018
Předmět:
Zdroj: AIP Advances, Vol 8, Iss 9, Pp 095215-095215-8 (2018)
Druh dokumentu: article
ISSN: 2158-3226
DOI: 10.1063/1.5046564
Popis: Resistive switching of W/amorphous (a)-SiOxCy:H/Cu resistive memories incorporating solely native back-end-of-line (BEOL) materials were studied. A-SiC1.1:H, a-SiO0.9C0.7:H, and a-SiO1.5C0.2:H were exploited as switching layers for resistive memories which all show resistive-switching characteristics with ultrahigh ON/OFF ratios in the range of 106 to 1010. Ohmic conduction in the low resistance state is attributed to the formation of Cu conductive filament inside the a-SiOxCy:H switching layer. Rupture of the conductive filament leads to current conduction dominated by Schottky emission through a-SiOxCy:H Schottky contacts. Comparison of the switching characteristics suggests composition of the a-SiOxCy:H has influences on VFORM and VSET, and current conduction mechanisms. These results demonstrate the capability to achieve functional W/a-SiOxCy:H/Cu using entirely BEOL native materials for future embedded resistive memories.
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