Strain-Reduction Induced Rise in Channel Temperature at Ohmic Contacts of GaN HEMTs

Autor: Steven J. Duffy, Brahim Benbakhti, Karol Kalna, Mohammed Boucherta, Wei D. Zhang, Nour E. Bourzgui, Ali Soltani
Jazyk: angličtina
Rok vydání: 2018
Předmět:
Zdroj: IEEE Access, Vol 6, Pp 42721-42728 (2018)
Druh dokumentu: article
ISSN: 2169-3536
DOI: 10.1109/ACCESS.2018.2861323
Popis: Operating temperature distributions in AlGaN/GaN gateless and gated devices are characterized and analyzed using the InfraScope temperature mapping system. For the first time, a substantial rise of channel temperature at the inner ends of ohmic contacts has been observed. Synchrotron radiation-based high-resolution X-ray diffraction technique combined with drift-diffusion simulations show that strain reduction at the vicinity of ohmic contacts increases electric field at these locations, resulting in the rise of lattice temperature. The thermal coupling of a high conductive tensile region at the contacts to a low conductive channel region is an origin of the temperature rise observed in both short- and long-channel gateless devices.
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