| Autor: |
Sabrina Patricia State (Rosoiu), Stefania Costovici, Marius Enachescu, Teodor Visan, Liana Anicai |
| Jazyk: |
angličtina |
| Rok vydání: |
2024 |
| Předmět: |
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| Zdroj: |
Materials, Vol 17, Iss 5, p 1034 (2024) |
| Druh dokumentu: |
article |
| ISSN: |
1996-1944 |
| DOI: |
10.3390/ma17051034 |
| Popis: |
Sn-Cu-Ni lead-free solder alloy electrodeposited on copper substrate from a deep eutectic solvent (DES)-based electrolyte under direct current (DC) and pulsed current (PC) was subjected to a reflowing process at the industrial company MIBATRON S.R.L. (Otopeni, Romania). The alteration of the alloy’s composition and anti-corrosive properties upon exposure to the reflow process were investigated via Scanning Electron Microscopy (SEM-EDX), X-ray diffraction (XRD), linear sweep voltammetry (LSV) and electrochemical impedance spectroscopy (EIS). Corrosion studies conducted in sodium chloride solution revealed that the system obtained under the DC plating mode (Sn-Cu-Ni-DC) exhibited enhanced anti-corrosive properties compared to the system obtained under PC (Sn-Cu-Ni-PC) after reflowing. However, prior to reflowing, the opposite effect was observed, with Sn-Cu-Ni-PC showing improved anti-corrosive properties. These changes in anti-corrosive behavior were attributed to the modification of the alloy’s composition during the reflowing process. |
| Databáze: |
Directory of Open Access Journals |
| Externí odkaz: |
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