| Autor: |
Nur Syahirah Mohamad Zaimi, Mohd Arif Anuar Mohd Salleh, Mohd Mustafa Al Bakri Abdullah, Mohd Izrul Izwan Ramli |
| Jazyk: |
angličtina |
| Rok vydání: |
2023 |
| Předmět: |
|
| Zdroj: |
Archives of Metallurgy and Materials, Vol vol. 68, Iss No 3, Pp 981-986 (2023) |
| Druh dokumentu: |
article |
| ISSN: |
2300-1909 |
| DOI: |
10.24425/amm.2023.145463 |
| Popis: |
For long time, Sn-Pb solder alloys have been used extensively as the main interconnection materials in the soldering. It is no doubt that Sn-Pb offers many advantages including good electrical conductivity, mechanical properties as well as low melting temperature. However, Pb is very toxic and Pb usage poses risk to human health and environments. Owing to this, the usage of Pb in the electronic industry was banned and restricted by the legislation. These factors accelerate the efforts in finding suitable replacement for solder alloy and thus lead-free solder was introduced. The major problems associated with lead-free solder is the formation of large and brittle intermetallic compound which have given a rise to the reliability issues. Micro alloying with Sb seems to be advantageous in improving the properties of existing lead-free solder alloy. Thus, this paper reviews the influence of Sb addition to the lead-free solder alloy in terms of microstructure formations and thermal properties. |
| Databáze: |
Directory of Open Access Journals |
| Externí odkaz: |
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