Improving the joint strength of thermoplastic composites joined by press joining using laser-based surface treatment

Autor: Alexander Liebsch, Daniel Wohlfahrt, Thomas Kuntze, Levin Schilling, Jana Gebauer, Robert Kupfer, Niels Modler, Andrés Fabián Lasagni, Maik Gude
Jazyk: angličtina
Rok vydání: 2024
Předmět:
Zdroj: Journal of Advanced Joining Processes, Vol 10, Iss , Pp 100260- (2024)
Druh dokumentu: article
ISSN: 2666-3309
DOI: 10.1016/j.jajp.2024.100260
Popis: Fibre-reinforced thermoplastic composites (TPC) provide an automated and cost-effective solution for their use in lightweight structures in series production. The combination of different material configurations allows the design of highly stress tolerant components. Previous studies demonstrated that the combination of TPC sheets, TPC hollow profiles and injection moulding compounds is even suitable for crash-relevant automotive parts. All three components are combined during the injection moulding process. To prevent collapse, the part must remain in a consolidated state and cannot be preheated. However, this results in poor adhesion between the hollow profile, the bulk material, and the TPC sheet. Previous studies have shown that the bonding strength between the hollow profile and the injection moulding compound can be increased by surface pre-treatment using laser structuring and plasma technology. In this work, laser structuring is employed to enhance the bonding strength between the hollow profile and the TPC sheet. Microscopy analysis is used to investigate the resulting surface morphology. Subsequently, single-lap-shear (SLS) specimens are produced by pressing the TPC sheets onto the flat part. The resulting bonding strengths are then evaluated by tensile shear tests. The study analyses the impact of various pre-treatment parameters on the bonding strength. Furthermore, it investigates the effect of sheet temperature on the bonding strength, including specimens without pre-treatment. Finally, the results of the surface treatment of hollow composite profiles are discussed.
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