Modification of the Cu-ETP copper surface layer with chromium by physical vapor deposition (PvD) and diffusion annealing
Autor: | M. Poreba, M. Pytel, M. Drajewicz, W. Ziaja, M. Góral |
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Jazyk: | angličtina |
Rok vydání: | 2022 |
Předmět: | |
Zdroj: | Metalurgija, Vol 61, Iss 3-4, Pp 673-676 (2022) |
Druh dokumentu: | article |
ISSN: | 0543-5846 1334-2576 |
Popis: | In the study, an attempt was made to increase durability of copper by creating a surface layer saturated or supersaturated with chromium only in the area of the highest thermo-mechanical loads during the welding process. There was developed a two-stage technological process, consisting of: application of chrome coating of the thickness approx. 1 µm on the Cu-ETP copper surface using the PVD method, and then performing the process of its diffusion by annealing at a temperature of 950°C in the vacuum. As a result, a diffusion CuCr layer with a thickness of approx. 20 µm was obtained, with hardness of approx. 120 HV0,01. |
Databáze: | Directory of Open Access Journals |
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