Strain analysis on the micro-nano-scale embedded asperities in the grinding process
| Autor: | Lianfeng Lai, Chenhui Gao, Jianmeng Huang |
|---|---|
| Jazyk: | angličtina |
| Rok vydání: | 2017 |
| Předmět: | |
| Zdroj: | Tehnički Vjesnik, Vol 24, Iss 5, Pp 1417-1424 (2017) |
| Druh dokumentu: | article |
| ISSN: | 1330-3651 1848-6339 |
| DOI: | 10.17559/TV-20170331071303 |
| Popis: | A two-dimensional micro-nano grinding model with the fractal surface is constructed, which considers the wear-out failures of the materials and the adhesive effects in the contact process. Also, the strain changes of the asperity during the grinding are dynamically discussed. The finite element method is employed to simulate the strain field in the process of grinding. It is indicated that the larger the interfacial shear strength is, at the same grinding distance, the greater its equivalent plastic strain is, the easier the rough solid is prone to wear and tear. The maximum point of the plastic deformation determines the first place where the first cracks occur, either on the surface or at a certain distance from the surface. Also, the larger the normal even-distributed load is, the larger the maximum plastic deformation of the asperity at the initial contact time is, which determines an earlier occurrence time of the initial cracks. Furthermore, the greater the grinding rate is, the longer the distance that two interactively contacting asperities start to wear is. By studying the distribution of the strain field of the embedded asperities, the real causes why the materials are ground and worn at the scale of micro-nano are explored. |
| Databáze: | Directory of Open Access Journals |
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