| Autor: |
Chuen-Lin Tien, Chun-Yu Chiang, Ching-Chiun Wang, Shih-Chin Lin |
| Jazyk: |
angličtina |
| Rok vydání: |
2024 |
| Předmět: |
|
| Zdroj: |
Inventions, Vol 9, Iss 3, p 61 (2024) |
| Druh dokumentu: |
article |
| ISSN: |
2411-5134 |
| DOI: |
10.3390/inventions9030061 |
| Popis: |
This study aims to investigate the thermomechanical properties of vanadium dioxide (VO2) thin films. A VO2 thin film was simultaneously deposited on B270 and H-K9L glass substrates by electron-beam evaporation with ion-assisted deposition. Based on optical interferometric methods, the thermal–mechanical behavior of and thermal stresses in VO2 films can be determined. An improved Twyman–Green interferometer was used to measure the temperature-dependent residual stress variations of VO2 thin films at different temperatures. This study found that the substrate has a great impact on thermal stress, which is mainly caused by the mismatch in the coefficient of thermal expansion (CTE) of the film and the substrate. By using the dual-substrate method, thermal stresses in VO2 thin films from room temperature to 120 °C can be evaluated. The thermal expansion coefficient is 3.21 × 10−5 °C−1, and the biaxial modulus is 517 GPa. |
| Databáze: |
Directory of Open Access Journals |
| Externí odkaz: |
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