Properties of diffusion-hardening composite solder modified with vanadium powder
| Autor: | V.М. Skachkov |
|---|---|
| Jazyk: | ruština |
| Rok vydání: | 2023 |
| Předmět: | |
| Zdroj: | Физико-химические аспекты изучения кластеров, наноструктур и наноматериалов, Iss 15, Pp 823-830 (2023) |
| Druh dokumentu: | article |
| ISSN: | 2226-4442 2658-4360 |
| DOI: | 10.26456/pcascnn/2023.15.823 |
| Popis: | The article considers the effect of vanadium metal powder on the properties of diffusion-hardening solder based on a low-melting gallium-tin alloy and a solid component consisting of a copper-tin alloy powder. After the introduction of vanadium metal powder in the amount of 5, 10 and 15 wt.%, solder samples were subjected to heat treatment at two different temperatures – 125 and 600°C. The microhardness and thermal stability of composite diffusion-hardening solders are evaluated. It is shown that heat treatment at higher temperatures promotes the transition of solder to an equilibrium state, which leads to an increase in hardness due to the formation and distribution of intermetallic compounds, including nanoscale ones. The phases of vanadium intermetallides formed as a result of interaction with gallium were determined by X-ray phase analysis. Metallic vanadium is wetted by gallium, has limited solubility, and increases solder hardness due to precipitation strengthening. |
| Databáze: | Directory of Open Access Journals |
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