| Autor: |
Tatsuhiko Aizawa, Hiroki Naka, Takeshi Nasu, Yoshiro Nogami |
| Jazyk: |
angličtina |
| Rok vydání: |
2022 |
| Předmět: |
|
| Zdroj: |
C, Vol 8, Iss 4, p 70 (2022) |
| Druh dokumentu: |
article |
| ISSN: |
2311-5629 |
| DOI: |
10.3390/c8040070 |
| Popis: |
Vertically aligned graphite substrate (VGS)-copper packaging was renowned for improving the robustness against the thermal gradient loading by using micro texturing. The micro-groove array with a line width of 50 μm and a pitch of 100 μm was formed into the VGS by controlling the line depth with the use of fast-rate oxygen plasma etching. Three micro-grooved VGS specimens were wet-plated to fill these microgrooves with copper deposits and to cover the VGS surfaces. The nearly full-deposited VGS-Copper specimens were subjected to a severe thermal transient loading test. The simply Cu-covered package and shallow rib-structured VGS-Cu packages were damaged to delaminate at their interfaces. The VGS-Cu package with the copper rib structure with a height of 50 μm experienced no delamination. This rib-structured VGS-copper package with high rib height had sufficient robustness against the severe thermal transients even with the proof of homogeneous thermal spreading capacity. |
| Databáze: |
Directory of Open Access Journals |
| Externí odkaz: |
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