| Autor: |
Zijia Liu, Xunguo Gong, Jinran Cheng, Lei Shao, Chunshui Wang, Jian Jiang, Ruiqing Cheng, Jun He |
| Jazyk: |
angličtina |
| Rok vydání: |
2024 |
| Předmět: |
|
| Zdroj: |
Chip, Vol 3, Iss 1, Pp 100080- (2024) |
| Druh dokumentu: |
article |
| ISSN: |
2709-4723 |
| DOI: |
10.1016/j.chip.2023.100080 |
| Popis: |
Two-dimensional (2D) van der Waals materials have attracted great interest and facilitated the development of post-Moore electronics owing to their novel physical properties and high compatibility with traditional microfabrication techniques. Their wafer-scale synthesis has become a critical challenge for large-scale integrated applications. Although the wafer-scale synthesis approaches for some 2D materials have been extensively explored, the preparation of high-quality thin films with well-controlled thickness remains a big challenge. This review focuses on the wafer-scale synthesis of 2D materials and their applications in integrated electronics. Firstly, several representative 2D layered materials including their crystal structures and unique electronic properties were introduced. Then, the current synthesis strategies of 2D layered materials at the wafer scale, which are divided into “top-down” and “bottom-up”, were reviewed in depth. Afterwards, the applications of 2D materials wafer in integrated electrical and optoelectronic devices were discussed. Finally, the current challenges and future prospects for 2D integrated electronics were presented. It is hoped that this review will provide comprehensive and insightful guidance for the development of wafer-scale 2D materials and their integrated applications. |
| Databáze: |
Directory of Open Access Journals |
| Externí odkaz: |
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