Decreasing Shear Stresses of the Solder Joints for Mechanical and Thermal Loads by Topological Optimization

Autor: Jan Awrejcewicz, Sergey P. Pavlov, Anton V. Krysko, Maxim V. Zhigalov, Kseniya S. Bodyagina, Vadim A. Krysko
Jazyk: angličtina
Rok vydání: 2020
Předmět:
Zdroj: Materials, Vol 13, Iss 8, p 1862 (2020)
Druh dokumentu: article
ISSN: 1996-1944
DOI: 10.3390/ma13081862
Popis: A methodology for obtaining the optimal structure and distribution for the gradient properties of a material in order to reduce the stress level in a soldered joint was constructed. The developed methodology was based on a combination of topological optimization methods (the moving asymptotes method) and the finite elements method; it was first implemented to solve problems of optimizing soldered joints. Using the proposed methodology, a number of problems were solved, allowing one to obtain optimal structural characteristics, in which a decrease in stress is revealed. Designing compounds using this technique will provide more robust designs. The proposed technique can be applied to a wide class of practical problems.
Databáze: Directory of Open Access Journals
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