Twyman effect in laser polishing of fused silica wafers

Autor: Lämmler Sven, Bischof David, Fähnle Oliver
Jazyk: angličtina
Rok vydání: 2024
Předmět:
Zdroj: EPJ Web of Conferences, Vol 309, p 03026 (2024)
Druh dokumentu: article
ISSN: 2100-014X
DOI: 10.1051/epjconf/202430903026
Popis: This paper investigates the challenges of minimizing wafer deformation during laser polishing of fused silica. The focus is on the Twyman effect, which causes unwanted curvature in thin plates. Strategies to reduce stress-induced deformation are proposed to enhance the reproducibility of the laser polishing process.
Databáze: Directory of Open Access Journals