Autor: |
Lämmler Sven, Bischof David, Fähnle Oliver |
Jazyk: |
angličtina |
Rok vydání: |
2024 |
Předmět: |
|
Zdroj: |
EPJ Web of Conferences, Vol 309, p 03026 (2024) |
Druh dokumentu: |
article |
ISSN: |
2100-014X |
DOI: |
10.1051/epjconf/202430903026 |
Popis: |
This paper investigates the challenges of minimizing wafer deformation during laser polishing of fused silica. The focus is on the Twyman effect, which causes unwanted curvature in thin plates. Strategies to reduce stress-induced deformation are proposed to enhance the reproducibility of the laser polishing process. |
Databáze: |
Directory of Open Access Journals |
Externí odkaz: |
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