Structural analysis of selective laser melted copper-tin alloy

Autor: Ramin Rahmani, Pedro R. Resende, Rúben Couto, Sérgio I. Lopes, Rahul Kumar, Himanshu S. Maurya, Javad Karimi, Alexandre M. Afonso, Abrar Hussain, João C.C. Abrantes
Jazyk: angličtina
Rok vydání: 2024
Předmět:
Zdroj: Journal of Alloys and Metallurgical Systems, Vol 7, Iss , Pp 100097- (2024)
Druh dokumentu: article
ISSN: 2949-9178
DOI: 10.1016/j.jalmes.2024.100097
Popis: Additively manufactured complex geometries from copper alloys with high thermal and mechanical properties have drawn the attention of researchers. The present contribution explores the additive manufacturing (AM) of copper-based alloys from powder particles intended for heat sink and heat exchange applications. Selective laser melting (SLM) parameters featuring low laser beam power (160 W), moderate scanning speed (320 mm/s), and high energy density (200 J/mm³) were employed to fabricate dense components from CuSn10 particles. The present work deal with structural analysis and precision investigation of microfabrication, particularly in Struts, Tubes, and Fins. Mechanical properties (compression and hardness) for Strut structure, differential pressure evaluations for Tube structure, and analyses of thermal and electrical conductivities for Fin structure were investigated. The results showed an improvement in strength compared to those of pure copper, facilitating ease of AM. The obtained results affirm the feasibility of AM, demonstrating the successful creation of complex and combined solid-porous structures using SLM process from Cu alloys. A comprehensive structural investigation and characterization of the Cu–Sn alloy is presented here, aiming to establish a standardized approach for analysing Cu alloys. The results indicate that small-scaled structures fabricated via CuSn10 alloy exhibits a thermal conductivity of 34.3 W·m⁻¹·K⁻¹, an electrical conductivity of 4.72×10⁶ S/m, a hardness of 119 HV-50, a uniform surface roughness of 6 µm, and can withstand a force loading of 1 kN.
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