Solder Wear Study on Electronic Boards using Nanoindentantions
| Autor: | MANEA Carla-Paula, COSTEA Traian-Octavian, MOLDOVAN Liviu |
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| Jazyk: | angličtina |
| Rok vydání: | 2022 |
| Předmět: | |
| Zdroj: | Journal of Electrical and Electronics Engineering, Vol 15, Iss 2, Pp 43-46 (2022) |
| Druh dokumentu: | article |
| ISSN: | 1844-6035 2067-2128 |
| Popis: | This paper presents a method for analysing the differences in solder interfaces between a new and an used printed circuit board (PCB). The study was carried out using the nanoindentation technique, the properties analysed being those of homogeneity, elasticity/rigidity of the solder paste on the contact areas. The analysed areas were selected after a few images obtained with the scanning electron microscope (SEM). The research was carried out in order to find out the possible causes of the defects appearance after a long time of use, it can be very difficult to find out the cause using the nanometre scale. |
| Databáze: | Directory of Open Access Journals |
| Externí odkaz: |
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