| Autor: |
Mona Knoblich, Mohammad Al Ktash, Frank Wackenhut, Tim Englert, Jan Stiedl, Hilmar Wittel, Simon Green, Timo Jacob, Barbara Boldrini, Edwin Ostertag, Karsten Rebner, Marc Brecht |
| Jazyk: |
angličtina |
| Rok vydání: |
2024 |
| Předmět: |
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| Zdroj: |
Sensors, Vol 24, Iss 14, p 4680 (2024) |
| Druh dokumentu: |
article |
| ISSN: |
1424-8220 |
| DOI: |
10.3390/s24144680 |
| Popis: |
In the manufacturing process of electrical devices, ensuring the cleanliness of technical surfaces, such as direct bonded copper substrates, is crucial. An in-line monitoring system for quality checking must provide sufficiently resolved lateral data in a short time. UV hyperspectral imaging is a promising in-line method for rapid, contactless, and large-scale detection of contamination; thus, UV hyperspectral imaging (225–400 nm) was utilized to characterize the cleanliness of direct bonded copper in a non-destructive way. In total, 11 levels of cleanliness were prepared, and a total of 44 samples were measured to develop multivariate models for characterizing and predicting the cleanliness levels. The setup included a pushbroom imager, a deuterium lamp, and a conveyor belt for laterally resolved measurements of copper surfaces. A principal component analysis (PCA) model effectively differentiated among the sample types based on the first two principal components with approximately 100.0% explained variance. A partial least squares regression (PLS-R) model to determine the optimal sonication time showed reliable performance, with R2cv = 0.928 and RMSECV = 0.849. This model was able to predict the cleanliness of each pixel in a testing sample set, exemplifying a step in the manufacturing process of direct bonded copper substrates. Combined with multivariate data modeling, the in-line UV prototype system demonstrates a significant potential for further advancement towards its application in real-world, large-scale processes. |
| Databáze: |
Directory of Open Access Journals |
| Externí odkaz: |
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