p-GaN Gate Enhancement-Mode HEMT Through a High Tolerance Self-Terminated Etching Process

Autor: Yu Zhou, Yaozong Zhong, Hongwei Gao, Shujun Dai, Junlei He, Meixin Feng, Yanfei Zhao, Qian Sun, An Dingsun, Hui Yang
Jazyk: angličtina
Rok vydání: 2017
Předmět:
Zdroj: IEEE Journal of the Electron Devices Society, Vol 5, Iss 5, Pp 340-346 (2017)
Druh dokumentu: article
ISSN: 2168-6734
DOI: 10.1109/JEDS.2017.2725320
Popis: An enhancement-mode high-electron-mobility transistor with a p-GaN gate was fabricated by using a chemistry-ease Cl2/N2/O2-based inductively coupled plasma etching technique. This etching technique features a precise etching self-termination at the AlGaN barrier surface, which enables a broad process window with a large tolerance of etching time. With a post-annealing process, the property of two-dimensional electron gas (2DEG) can be restored to a high level after the etching. The mechanisms of etching self-termination and 2DEG recovery were clarified. The fabricated device exhibits a drain saturation current of 355 mA/mm with a threshold voltage of +1.1 V, an on/off ratio of 107, and a static on-resistance RON of 10 Ω·mm. Furthermore, normally-off operation of the device can be achieved across the wafer.
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