Electronic‐photonic board as an integration platform for Tb/s multi‐chip optical communication

Autor:	Tobias Lamprecht, Felix Betschon, Johan Bauwelinck, Joris Van Kerrebrouck, Joris Lambrecht, Holger Gaul, Alexander Eichler, Xin Yin
Jazyk:	angličtina
Rok vydání:	2021
Předmět:	electro‐optical devices elemental semiconductors flip‐chip devices integrated optics optical polymers optical switches Applied optics. Photonics TA1501-1820
Zdroj:	IET Optoelectronics, Vol 15, Iss 2, Pp 92-101 (2021)
Druh dokumentu:	article
ISSN:	1751-8776 1751-8768
DOI:	10.1049/ote2.12017
Popis:	Abstract Chip‐on‐board silicon photonics O‐band wavelength‐division multiplexing transceivers have been developed that will eventually enable high‐throughput on‐board optical communication for multi‐socket on‐board communication. This direct, any‐to‐any configuration yields low‐latency, low‐power optical communication among multiple compute nodes on the board. Silicon photonic transceiver chips are flip‐chipped on a polymer waveguide containing an electro‐optical circuit board using adiabatic coupling and then completed with driver and amplifier electronic chips. A transceiver assembly based on wire‐bond technology verifies 50 Gb/s operation per channel, and the flip‐chip version demonstrates the chip on‐board assembly techniques for compact on‐board transceivers.
Databáze:	Directory of Open Access Journals
Externí odkaz:	https://doaj.org/article/82ae20652f494373b66a7e3ef55d84a6 Zobrazit plný text záznamu Plný text View record in DOAJ