Hygroscopic compounds in spider aggregate glue remove interfacial water to maintain adhesion in humid conditions

Autor: Saranshu Singla, Gaurav Amarpuri, Nishad Dhopatkar, Todd A. Blackledge, Ali Dhinojwala
Jazyk: angličtina
Rok vydání: 2018
Předmět:
Zdroj: Nature Communications, Vol 9, Iss 1, Pp 1-8 (2018)
Druh dokumentu: article
ISSN: 2041-1723
DOI: 10.1038/s41467-018-04263-z
Popis: Spider aggregate glue avoids failure in humid environments but the fundamental mechanism behind it is still unknown. Here, the authors demonstrate that humidity-dependent structural changes of glycoproteins and sequestering of liquid water by low molecular mass compounds prevents adhesion failure of the glue in humid environments.
Databáze: Directory of Open Access Journals