| Autor: |
Fei Sun, Na Zhang, Shen Chen, Moucheng Li |
| Jazyk: |
angličtina |
| Rok vydání: |
2024 |
| Předmět: |
|
| Zdroj: |
Metals, Vol 14, Iss 5, p 543 (2024) |
| Druh dokumentu: |
article |
| ISSN: |
2075-4701 |
| DOI: |
10.3390/met14050543 |
| Popis: |
The corrosion behavior of copper was investigated in synthetic tap water with and without sodium hypochlorite (NaClO) at different temperatures during immersion for 70 d by using scanning electron microscopy (SEM), X-ray diffraction (XRD), and electrochemical measurement techniques. The weight loss corrosion rate and pit depth of copper first increase and then decrease with the change in solution temperature from 25 to 80 °C. This is mainly related to the corrosion products formed on the copper surface. The main corrosion products change from Cu2O and Cu2(OH)2CO3 to CuO with the increase in solution temperature. The presence of 3 ppm NaClO slightly increases the weight loss corrosion rate and pit depth of copper under all temperatures except for 50 °C and reduces the temperature of the maximum corrosion rate from 50 to 40 °C. Free chlorine reduction accelerates the cathodic reaction of the corrosion process. |
| Databáze: |
Directory of Open Access Journals |
| Externí odkaz: |
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