Impact of Solvent Evaporation and Curing Protocol on Degree of Conversion of Etch-and-Rinse and Multimode Adhesives Systems

Autor: Ceci Nunes Carvalho, Marcos Daniel Septímio Lanza, Letícia Gomes Dourado, Edilausson Moreno Carvalho, José Bauer
Jazyk: angličtina
Rok vydání: 2019
Předmět:
Zdroj: International Journal of Dentistry, Vol 2019 (2019)
Druh dokumentu: article
ISSN: 1687-8728
1687-8736
DOI: 10.1155/2019/5496784
Popis: Objectives. This study evaluated the effect of air-drying time and light-curing time on the degree of conversion (DC) of three etch-and-rinse adhesive systems: ONE-STEP (OS) and ONE-STEP plus (OSP), Ambar (AMB), and two multimode adhesive systems: All-Bond Universal (ABU) and ScotchBond Universal (SBU) by Fourier transform infrared (FTIR) analysis. Materials and Methods. The DC of each adhesive system was analyzed with six experimental different protocols: (1) immediate light curing for 10 s without solvent volatilization; (2) 10 s solvent volatilization with air stream plus 10 s light curing; (3) 60 s solvent volatilization with air stream plus 10 s light curing; (4) immediate light curing for 20 s without solvent volatilization; (5) 10 s solvent volatilization with air stream plus 20 s light curing; and (6) 60 s solvent volatilization with air stream plus 20 s light curing. FTIR spectra were obtained, and the DC was calculated by comparing the ratio of aliphatic/aromatic double carbon bonds before and after light activation (Bluephase 20i). The DC means were analyzed by three-way analysis of variance (ANOVA) and post hoc Tukey tests (α = 0.05). Results. Three-way ANOVA showed statistically significant adhesive, air-drying, and light-cured time (p
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