Properties and Microstructures of Sn-Bi-X Lead-Free Solders
| Autor: | Fan Yang, Liang Zhang, Zhi-quan Liu, Su-juan Zhong, Jia Ma, Li Bao |
|---|---|
| Jazyk: | angličtina |
| Rok vydání: | 2016 |
| Předmět: | |
| Zdroj: | Advances in Materials Science and Engineering, Vol 2016 (2016) |
| Druh dokumentu: | article |
| ISSN: | 1687-8434 1687-8442 |
| DOI: | 10.1155/2016/9265195 |
| Popis: | The Sn-Bi base lead-free solders are proposed as one of the most popular alloys due to the low melting temperature (eutectic point: 139°C) and low cost. However, they are not widely used because of the lower wettability, fatigue resistance, and elongation compared to traditional Sn-Pb solders. So the alloying is considered as an effective way to improve the properties of Sn-Bi solders with the addition of elements (Al, Cu, Zn, Ga, Ag, In, Sb, and rare earth) and nanoparticles. In this paper, the development of Sn-Bi lead-free solders bearing elements and nanoparticles was reviewed. The variation of wettability, melting characteristic, electromigration, mechanical properties, microstructures, intermetallic compounds reaction, and creep behaviors was analyzed systematically, which can provide a reference for investigation of Sn-Bi base solders. |
| Databáze: | Directory of Open Access Journals |
| Externí odkaz: |
|