Corrosion characteristics of single-phase Mg–3Zn alloy thin film for biodegradable electronics

Autor: Ji-Woo Gu, Jae-Young Bae, Guangzhe Li, Hae Won Hwang, So-Hyeon Lee, Sung-Geun Choi, Ju-Young Kim, Myoung-Ryul Ok, Yu-Chan Kim, Seung-Kyun Kang
Jazyk: angličtina
Rok vydání: 2023
Předmět:
Zdroj: Journal of Magnesium and Alloys, Vol 11, Iss 9, Pp 3241-3254 (2023)
Druh dokumentu: article
ISSN: 2213-9567
DOI: 10.1016/j.jma.2023.06.016
Popis: Biodegradable metals as electrodes, interconnectors, and device conductors are essential components in the emergence of transient electronics, either for passive implants or active electronic devices, especially in the fields of biomedical electronics. Magnesium and its alloys are strong candidates for biodegradable and implantable conducting materials because of their high conductivity and biocompatibility, in addition to their well-understood dissolution behavior. One critical drawback of Mg and its alloys is their considerably high dissolution rates originating from their low anodic potential, which disturbs the compatibility to biomedical applications. Herein, we introduce a single-phase thin film of a Mg–Zn binary alloy formed by sputtering, which enhances the corrosion resistance of the device electrode, and verify its applicability in biodegradable electronics. The formation of a homogeneous solid solution of single-phase Mg–3Zn was confirmed through X-ray diffraction and transmission electron microscopy. In addition, the dissolution behavior and chemistry was also investigated in various biological fluids by considering the effect of different ion species. Micro-tensile tests showed that the Mg–3Zn alloy electrode exhibited an enhanced yield strain and elongation in relation to a pure Mg electrode. Cell viability test revealed the high biocompatibility rate of the Mg–3Zn binary alloy thin film. Finally, the fabrication of a wireless heater demonstrated the integrability of biodegradable electrodes and highlighted the ability to prolong the lifecycle of thermotherapy-relevant electronics by enhancing the dissolution resistance of the Mg alloy.
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