| Autor: |
Jarkko Tolvanen, Mikko Nelo, Heidi Alasmäki, Olli Pitkänen, Timo Vahera, Jari Hannu, Jari Juuti, Heli Jantunen |
| Jazyk: |
angličtina |
| Rok vydání: |
2024 |
| Předmět: |
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| Zdroj: |
Advanced Materials Interfaces, Vol 11, Iss 13, Pp n/a-n/a (2024) |
| Druh dokumentu: |
article |
| ISSN: |
2196-7350 |
| DOI: |
10.1002/admi.202300960 |
| Popis: |
Abstract Solution‐processable organic conductor–supramolecular elastomer blends are emerging materials for intrinsically stretchable and autonomously self‐healing organic electronics. Herein, the feasibility of a heterogenous multiphase polymer blend is demonstrated for soft, ultraflexible, self‐adhesive, and self‐healing multilayered film structures for electromagnetic interference (EMI) shielding and microwave absorber (MWA) purposes. The developed soft multilayered films achieve a 5–40 fold improvement in the thickness of the MWA compared to the current state‐of‐the‐art. The thickness normalized reflection loss (RL) is up to 65.26 dB mm−1 with 8.5 GHz bandwidth at 18–26.5 GHz. The maximum thickness normalized EMI shielding effectiveness peaks at up to 175 dB mm−1. The EMI shielding and MWA properties are maintainable up to 150% tensile strain with only a small decrease in the overall attenuation and RL. Furthermore, the developed films are capable of fully autonomously self‐healing and achieve a tough adhesion in temperatures of −30–145 °C, and underwater with maximum single‐lap shear adhesion strength of ≈481.5 kPa to soft thermoplastic polyurethane films. Thus, the developed multilayered films can be utilized for absorption‐dominant EMI shielding or MWA purposes as stretchable coatings. The developed materials also show considerable potential for emerging damage and puncture‐resistant organic soft electronics with autonomous material‐level self‐healing. |
| Databáze: |
Directory of Open Access Journals |
| Externí odkaz: |
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