| Autor: |
Kluska Sven, Grübel Benjamin, Cimiotti Gisela, Schmiga Christian, Berg Heinrich, Beinert Andreas, Kubitza Irene, Müller Paul, Voss Torsten |
| Jazyk: |
angličtina |
| Rok vydání: |
2021 |
| Předmět: |
|
| Zdroj: |
EPJ Photovoltaics, Vol 12, p 10 (2021) |
| Druh dokumentu: |
article |
| ISSN: |
2105-0716 |
| DOI: |
10.1051/epjpv/2021010 |
| Popis: |
This work demonstrates that the application of plated Ni/Cu/Ag contacts for TOPCon solar cells and modules is a reliable alternative to screen-printed metallization. Key advantages of plated metallization is a significant reduction of material costs [B. Grübel et al., in Proceedings 11th SiliconPV Conference, Hamelin, 2021, to be published] due to the substitution of a fully printed silver finger by a stack of a thin nickel seed layer (0.5-1 μm height), highly conductive copper finger (3–10 μm height) and an ultra-thin surface finish by tin (1–3 μm height) or silver ( |
| Databáze: |
Directory of Open Access Journals |
| Externí odkaz: |
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