| Autor: |
Takashi SUMIGAWA, Emi KAWAI, Tomoya MARUMO, Hisashi TANIE, Takayuki KITAMURA |
| Jazyk: |
japonština |
| Rok vydání: |
2015 |
| Předmět: |
|
| Zdroj: |
Nihon Kikai Gakkai ronbunshu, Vol 81, Iss 831, Pp 15-00446-15-00446 (2015) |
| Druh dokumentu: |
article |
| ISSN: |
2187-9761 |
| DOI: |
10.1299/transjsme.15-00446 |
| Popis: |
The purpose of this study is to investigate the dominant factor on the fracture strength of thin film comprising of copper (Cu) helical nano-elements, which are grown by the glancing angle deposition technique. By changing the deposition angle in the GLAD, three types of thin films with different number density of Cu helical nano-elements are produced. Crack initiation experiments are carried out using cantilever specimens where the thin film is constrained by a substrate and a stainless cantilever. Near the edge of thin film, the critical forces applied to Cu helical nano-elements at the fracture are mostly consistent regardless of the number density of nano-elements although the critical average stresses are different. This result signifies that the fracture of the thin film is governed by the strength of nano-element. |
| Databáze: |
Directory of Open Access Journals |
| Externí odkaz: |
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