Models of printed boards for solderless mounting of electronic components by foil perforation method

Autor:	Yefimenko A. A., Paliukh B. P.
Jazyk:	English<br />Russian
Rok vydání:	2017
Předmět:	printed circuit board foil puncture method hole mounting method surface mounting Electrical engineering. Electronics. Nuclear engineering TK1-9971
Zdroj:	Tekhnologiya i Konstruirovanie v Elektronnoi Apparature, Iss 4-5, Pp 3-9 (2017)
Druh dokumentu:	article
ISSN:	2225-5818 2309-9992
DOI:	10.15222/TKEA2017.4-5.03
Popis:	The paper presents models of printed circuit boards for an improved foil perforation method. The density of electrical connections of such printed circuit boards is estimated in comparison with circuit boards obtained using the methods of mounting in holes and surface mounting. The technological differences in the manufacture of printed circuit boards for the foil perforation method and the traditional method are considered.
Databáze:	Directory of Open Access Journals
Externí odkaz:	https://doaj.org/article/a5c54c2f7f9440feba511cb93478c043 Zobrazit plný text záznamu View record in DOAJ