A Handy Flexible Micro-Thermocouple Using Low-Melting-Point Metal Alloys

Autor: Qifu Wang, Meng Gao, Lunjia Zhang, Zhongshan Deng, Lin Gui
Jazyk: angličtina
Rok vydání: 2019
Předmět:
Zdroj: Sensors, Vol 19, Iss 2, p 314 (2019)
Druh dokumentu: article
ISSN: 1424-8220
DOI: 10.3390/s19020314
Popis: A handy, flexible micro-thermocouple using low-melting-point metal alloys is proposed in this paper. The thermocouple has the advantages of simple fabrication and convenient integration. Bismuth/gallium-based mixed alloys are used as thermocouple materials. To precisely inject the metal alloys to the location of the sensing area, a micro-polydimethylsiloxane post is designed within the sensing area to prevent outflow of the metal alloy to another thermocouple pole during the metal-alloy injection. Experimental results showed that the Seebeck coefficient of this thermocouple reached −10.54 μV/K, which was much higher than the previously reported 0.1 μV/K. The thermocouple was also be bent at 90° more than 200 times without any damage when the mass ratio of the bismuth-based alloy was
Databáze: Directory of Open Access Journals
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