Microstructure of Joint between Stranded Wire and Substrate Welded by Ultrasonic Welding
| Autor: | Chihiro Iwamoto, Keisuke Yamauchi, Kazuki Motomura, Yoichi Hashimoto, Kensuke Hamada |
|---|---|
| Jazyk: | angličtina |
| Rok vydání: | 2019 |
| Předmět: |
stranded wire
stranded conductor ultrasonic welding wedge bonding electron back scattered diffraction pattern microstructure transmission electron microscopy Cu wire Technology Engineering (General). Civil engineering (General) TA1-2040 Biology (General) QH301-705.5 Physics QC1-999 Chemistry QD1-999 |
| Zdroj: | Applied Sciences, Vol 9, Iss 3, p 534 (2019) |
| Druh dokumentu: | article |
| ISSN: | 2076-3417 |
| DOI: | 10.3390/app9030534 |
| Popis: | In order to improvement electronic and mechanical properties, welding between stranded wires and terminals is important. However, welding methods to obtain high-quality joints using stranded wires are still limited. In this report, we applied ultrasonic welding to join a Cu stranded wire to a Cu substrate. Cross-sections of the weldments were taken and observed by several microscopy techniques to elucidate the weldability and soundness of the joints. After ultrasonic welding, each wire in the stranded wire was joined together at the region where the stranded wire was joined to the substrate without any defect. Each wire was welded through the Ag coating layer, and the stranded wire and the substrate was also welded through the outermost coating layers. It was found that ultrasonic welding is an efficient technique for producing high quality joints without any defect at the interface. |
| Databáze: | Directory of Open Access Journals |
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