Research on the process of metal facing packaging
| Autor: | O.O., O.V., S.I., V.A. |
|---|---|
| Jazyk: | English<br />Ukrainian |
| Rok vydání: | 2023 |
| Předmět: | |
| Zdroj: | Технічна інженерія, Vol 1, Iss 91, Pp 101-109 (2023) |
| Druh dokumentu: | article |
| ISSN: | 2706-5847 2707-9619 |
| DOI: | 10.26642/ten-2023-1(91)-101-109 |
| Popis: | Washed and dried metal facing is most expedient to use in steelmaking in the form of bags or briquettes. This makes it possible to turn facing into high-quality bulk material, which replaces piece metal scrap during remelting. It should be noted that it is practically impossible to obtain high-quality packages from metal facing, and that is why the research of the processes of chipping into pieces is relevant and important. In Ukraine, domestic scientists of Iron and Steel Institute, the Dnipropetrovsk Metallurgical Academy, and the Dnipro State Technical University made a significant contribution to the development of metal scrap and facing processes. Two methods of pulverizing chips have become widespread in the industry: briquetting and bagging. It is recommended to use only crushed chips for briquetting. The second method of shredding metal facing is its packaging. But it is not possible to pack spiral-shaped steel facing, because with high pressing forces it collapses, and with low forces the packages fall apart. Therefore, steel facing must be packaged in an annealed state. This chip packaging technology was proposed and researched in the laboratories of the Department of Mechanical Engineering Technology of the Dnipro State Technical University. Experimental studies of the process of packaging steel facing were carried out in order to determine the optimal modes of packaging according to the proposed technology. Research was conducted on a laboratory packaging press, as well as on an industrial press BA 1330. The article examines and describes the methods of packaging and briquetting of metal facing existing in the industry, the technology of packaging facing in the annealed state is proposed. Based on the obtained results, recommendations were made for improving the equipment and the chip packaging technology was considered. |
| Databáze: | Directory of Open Access Journals |
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