Influence of Flux and Related Factors on Intermetallic Layer Growth within SAC305 Solder Joints

Autor:	Karel Dušek, Petr Veselý, David Bušek, Adam Petráč, Attila Géczy, Balázs Illés, Oliver Krammer
Jazyk:	angličtina
Rok vydání:	2021
Předmět:	solder flux reflow soldering SAC solder alloy solder mask surface finish Technology Electrical engineering. Electronics. Nuclear engineering TK1-9971 Engineering (General). Civil engineering (General) TA1-2040 Microscopy QH201-278.5 Descriptive and experimental mechanics QC120-168.85
Zdroj:	Materials, Vol 14, Iss 24, p 7909 (2021)
Druh dokumentu:	article
ISSN:	14247909 1996-1944
DOI:	10.3390/ma14247909
Popis:	Flux contained in solder paste significantly affects the process of solder joint creation during reflow soldering, including the creation of an intermetallic layer (IML). This work investigates the dependence of intermetallic layer thickness on ROL0/ROL1 flux classification, glossy or matt solder mask, and OSP/HASL/ENIG soldering pad surface finish. Two original SAC305 solder pastes differing only in the used flux were chosen for the experiment. The influence of multiple reflows was also observed. The intermetallic layer thicknesses were obtained by the image analysis of micro-section images. The flux type proved to have a significant impact on the intermetallic layer thickness. The solder paste with ROL1 caused an increase in IML thickness by up to 40% in comparison to an identical paste with ROL0 flux. Furthermore, doubling the roughness of the solder mask has increased the resulting IML thickness by 37% at HASL surface finish and by an average of 22%.
Databáze:	Directory of Open Access Journals
Externí odkaz:	https://doaj.org/article/563820af12054a5f89dfc5d8dd866fa1 Zobrazit plný text záznamu View record in DOAJ Plný text ve formátu PDF Plný text ve formátu HTML
Nepřihlášeným uživatelům se plný text nezobrazuje	K zobrazení výsledku je třeba se přihlásit.