| Autor: |
Lin Chen, Yanjun Chen, Huisheng Yang, Yanjing Su, Lijie Qiao |
| Jazyk: |
angličtina |
| Rok vydání: |
2021 |
| Předmět: |
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| Zdroj: |
Electrochemistry Communications, Vol 131, Iss , Pp 107124- (2021) |
| Druh dokumentu: |
article |
| ISSN: |
1388-2481 |
| DOI: |
10.1016/j.elecom.2021.107124 |
| Popis: |
The purpose of this study is to investigate the correlation between intergranular stress corrosion cracking (IGSCC) and grain boundary characteristics in brass. The Volta potential and nature of the grain boundaries in H62 brass were studied by scanning Kelvin probe force microscopy and Electron Backscattered Diffraction, respectively. The α/β phase boundaries and random grain boundaries with low work functions can act as anodic areas to promote IGSCC propagation. Moreover, due to a combination of the inherent characteristics and high work function of Σ3 annealing twin boundaries (ATBs), IGSCC is successfully halted at a triple junction containing Σ3 ATB. |
| Databáze: |
Directory of Open Access Journals |
| Externí odkaz: |
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Full Text from ScienceDirect