A solvent-free processed low-temperature tolerant adhesive

Autor: Xiaoming Xie, Yulian Jiang, Xiaoman Yao, Jiaqi Zhang, Zilin Zhang, Taoping Huang, Runhan Li, Yifa Chen, Shun-Li Li, Ya-Qian Lan
Jazyk: angličtina
Rok vydání: 2024
Předmět:
Zdroj: Nature Communications, Vol 15, Iss 1, Pp 1-8 (2024)
Druh dokumentu: article
ISSN: 2041-1723
DOI: 10.1038/s41467-024-49503-7
Popis: Abstract Ultra-low temperature resistant adhesive is highly desired yet scarce for material adhesion for the potential usage in Arctic/Antarctic or outer space exploration. Here we develop a solvent-free processed low-temperature tolerant adhesive with excellent adhesion strength and organic solvent stability, wide tolerable temperature range (i.e. −196 to 55 °C), long-lasting adhesion effect ( > 60 days, −196 °C) that exceeds the classic commercial hot melt adhesives. Furthermore, combine experimental results with theoretical calculations, the strong interaction energy between polyoxometalate and polymer is the main factor for the low-temperature tolerant adhesive, possessing enhanced cohesion strength, suppressed polymer crystallization and volumetric contraction. Notably, manufacturing at scale can be easily achieved by the facile scale-up solvent-free processing, showing much potential towards practical application in Arctic/Antarctic or planetary exploration.
Databáze: Directory of Open Access Journals