| Autor: |
Jaewoo Song, Se-Hoon Park, Hyun-jin Nam, Muhammad Naqi |
| Jazyk: |
angličtina |
| Rok vydání: |
2023 |
| Předmět: |
|
| Zdroj: |
AIP Advances, Vol 13, Iss 5, Pp 055119-055119-8 (2023) |
| Druh dokumentu: |
article |
| ISSN: |
2158-3226 |
| DOI: |
10.1063/5.0142050 |
| Popis: |
In advanced millimeter-wave packaging technology, signal loss is considered the main problem, which can be resolved using low-loss circuits for minimizing transmission losses. Herein, the radio frequency integrated circuit (RF-IC), an active element, and the antenna are assembled in one package form to realize such a low-loss circuit by utilizing the modified polyimide (MPI) material. The material analysis of MPI reveals a dielectric constant of 2.5 with a loss of 0.0025 mm-waves (at 20 GHz) and confirms the curability of the proposed film at lower temperatures through differential scanning calorimetry analysis. Next, the antenna and the RF-IC were assembled in a single package using MPI to verify their suitability for the millimeter wave package. The 1 dB gain compression point (P1dB) of the integrated module is measured to be 31 dBm, with 20.38 dBm for a single RF-IC, confirming that the proposed MPI is a suitable candidate as a low-loss circuit for modern millimeter-wave packaging technology. |
| Databáze: |
Directory of Open Access Journals |
| Externí odkaz: |
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