| Autor: |
Hwang Jun Ho, Lee Jong-Hyun |
| Jazyk: |
angličtina |
| Rok vydání: |
2017 |
| Předmět: |
|
| Zdroj: |
Archives of Metallurgy and Materials, Vol 62, Iss 2, Pp 1143-1148 (2017) |
| Druh dokumentu: |
article |
| ISSN: |
2300-1909 |
| DOI: |
10.1515/amm-2017-0167 |
| Popis: |
Sn-coated Cu particles were prepared as a filler material for transient liquid phase (TLP) bonding. The thickness of Sn coating was controlled by controlling the number of plating cycles. The Sn-coated Cu particles best suited for TLP bonding were fabricated by Sn plating thrice, and the particles showed a pronounced endothermic peak at 232°C. The heating of the particles for just 10 s at 250°C destroyed the initial core-shell structure and encouraged the formation of Cu-Sn intermetallic compounds. Further, die bonding was also successfully performed at 250°C under a slight bonding pressure of around 0.1 MPa using a paste containing the particles. The bonding time of 30 s facilitated the bonding of Sn-coated Cu particles to the Au surface and also increased the probability of network formation between particles. |
| Databáze: |
Directory of Open Access Journals |
| Externí odkaz: |
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