Investigating the tribological characteristics of copper surface composites reinforced with high entropy alloy (AlCoCrCuFe) through friction stir processing

Autor: Seenivasan Soundararajan, Gopal Pudhupalayam Muthukutti, Soorya Prakash Kumarasamy, Kavimani Vijayananth, Debabrata Barik, Prabhakar Sharma, Prabhu Paramasivam
Jazyk: angličtina
Rok vydání: 2023
Předmět:
Zdroj: Scientific Reports, Vol 13, Iss 1, Pp 1-16 (2023)
Druh dokumentu: article
ISSN: 2045-2322
DOI: 10.1038/s41598-023-49557-5
Popis: Abstract The present investigation focuses on the fabrication of Copper-High Entropy Alloy (HEA) surface Metal Matrix Composite (MMC) using the solid-state Friction Stir Process (FSP) and the characterization of wear characteristics. Higher hardness values at the level of 770HV were the cornerstone in its selection, in addition to identifying several appropriate considerations for combining the AlCoCrCuFe HEA in Cu-HEA surface MMCs. Because of the combination of FSP and HEA, the produced composite had a fine microstructure and increased hardness. The wear test is carried out using pin-on-disc equipment for all conceivable parameter combinations to thoroughly analyze wear qualities, with velocity, load, as well as sliding distance chosen as input parameters. The wear rate decreases dramatically with HEA additions and rises with sliding velocity, load, and sliding distance. The impact of HEA addition on the Coefficient of Friction (CoF) during a dry sliding wear test is opposed to its influence on wear rate. The wear parameters such as load, sliding speed, and sliding distance possess a positive correlation with the wear rate and a negative correlation with a coefficient of friction. The applied load has a severe effect on wear rate and CoF when compared to other wear parameters considered. Scanning Electron Microscope (SEM) micrographs of the worn surface were utilized to analyze the wear process, which clearly showed that the copper’s wear resistance improved with the addition of HEA.
Databáze: Directory of Open Access Journals
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