Preparation and Characterization of High Temperature Resistant Polyimide Films

Autor:	Li Zhirui, Hou Yong, Ma Pengchang, Zhao Wenhua
Jazyk:	English<br />French
Rok vydání:	2022
Předmět:	Engineering (General). Civil engineering (General) TA1-2040
Zdroj:	MATEC Web of Conferences, Vol 358, p 01046 (2022)
Druh dokumentu:	article
ISSN:	2261-236X 32881010
DOI:	10.1051/matecconf/202235801046
Popis:	To prepare high temperature resistant polyimide thin films, we have discussed the synthesis of high-purity diamine precursors in this study. We have prepared polyamide acid solutions first via two-step solution-based polymerization of heat-resisting diamine and dianhydride, and then obtain polyimides after dehydration during a high temperature curing process. The thermal, mechanical and hygroscopic properties of four polyimides thin films were tested and compared.
Databáze:	Directory of Open Access Journals
Externí odkaz:	https://doaj.org/article/415f328810104cde9fccd4699aa8ed3c Zobrazit plný text záznamu View record in DOAJ