Devices for quality control of welded joints of leads of packageless chips

Autor:	Spirin V. G.
Jazyk:	English<br />Russian
Rok vydání:	2013
Předmět:	microassembly quality control of microcircuit leads welding Electrical engineering. Electronics. Nuclear engineering TK1-9971
Zdroj:	Tekhnologiya i Konstruirovanie v Elektronnoi Apparature, Iss 4, Pp 42-43 (2013)
Druh dokumentu:	article
ISSN:	2225-5818
Popis:	The author considers the design and operation of two devices for quality control of welded joints between aluminum leads of packageless microcircuits and contact pads of a thin-film circuit.
Databáze:	Directory of Open Access Journals
Externí odkaz:	https://doaj.org/article/40546b0d1e6048c9b2a8cb556df849f7 Zobrazit plný text záznamu View record in DOAJ